| PART |
Description |
Maker |
| WCSMCFC-32.768KHZ- WCSMCF-32.768KHZ-6 WCSMCC-32.76 |
4 Pad Ceramic SMD Package
|
MMD Components
http://
|
| ILCX09-GI1F18-20.000 ILCX09-HF3F18-20.000 ILCX09-B |
2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm
|
ILSI America LLC
|
| ILCX07-GHD318-20.000 ILCX07-GHDF18-20.000 ILCX07-B |
4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
4 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
|
ILSI America LLC
|
| 920-AM-3E1-TTS 920-AM-3E1-TTS-001 |
x 7 Ceramic 6 Pad LVDS Output
|
Oscilent Corporation
|
| 495-28.0M-3DN-T 495-28.0M-5DN-T 495-28.0M-5EN-T 73 |
5 x 7 Ceramic 6 Pad PECL Output
|
Oscilent Corporation
|
| 21-0111 |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD
|
Maxim Integrated Products
|
| 21-0108 |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
|
Maxim Integrated Products
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P2NS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| IL3S-HJ9F18-20.000 IL3S-JH9F18-20.000 IL3S-BI9F18- |
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
|
ILSI America LLC
|
| HC49USM8-BI0F18-20.000 HC49USM8-BI1318-20.000 HC49 |
4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
|
ILSI America LLC
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
